| Quantity: | |
|---|---|
BSD
Product Description
| PCD Diamond Grinding Pads | |
| Material | Metal+diamond+PCD |
| Segment size | 1/4PCD+1Protection (Any segments can be made) |
| Body hole | 3-9mm (Any type can be made, like HTC, Husqvarna, lavina, Sase, werkmaster, STI, Germany local brands, and etc) |
| Color/Marking | As customers' requirements |
| Used | For aggressive removal of adhesive residues, levelling compounds, varnish, glue, epoxy. |
| Features: | 1. For aggressive removal of adhesive residues and levelling compounds. 2. With high efficient for the toughest situation. 3. Can fit all world-wide floor grinding machines with different holders. 4. We also provide customization services to fullfill any special requirements |
*Other specifications are available upon request.
Product Description
| PCD Diamond Grinding Pads | |
| Material | Metal+diamond+PCD |
| Segment size | 1/4PCD+1Protection (Any segments can be made) |
| Body hole | 3-9mm (Any type can be made, like HTC, Husqvarna, lavina, Sase, werkmaster, STI, Germany local brands, and etc) |
| Color/Marking | As customers' requirements |
| Used | For aggressive removal of adhesive residues, levelling compounds, varnish, glue, epoxy. |
| Features: | 1. For aggressive removal of adhesive residues and levelling compounds. 2. With high efficient for the toughest situation. 3. Can fit all world-wide floor grinding machines with different holders. 4. We also provide customization services to fullfill any special requirements |
*Other specifications are available upon request.
