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Diamond Grinding plate for htc machine
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Diamond Grinding plate for htc machine

Metal Bond Diamond HTC Grinding Segment
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  • BSD

Product Description

*This diamond grinding pad is metal bond grinding shoes for stone and concrete floor girinding with aggressive diamond inside for fast grinding and leveling. Soft to hard bond for stone and concrete floor in different grit.
*It used to floor grinding machine.

Specification:
1.Tapezoid grinding shoes.
2.Grit:#30-400,as required.

0612 BSD a

0612 BSD b


Produce Process

微信图片_20200323152549diamond grinding pad process



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