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HTC Diamond Grinding Plate for Concrete Terrazo Grinding
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HTC Diamond Grinding Plate for Concrete Terrazo Grinding

Metal Bond Diamond HTC Grinding Segment

Quantity:
  • BSD

Product Description

*This diamond grinding pad is metal bond grinding shoes for stone and concrete floor girinding with aggressive diamond inside for fast grinding and leveling. Soft to hard bond for stone and concrete floor in different grit.
*It used to floor grinding machine.

HTC Diamond Grinding Pads
Material
Metal+diamond
Segment size
HTC*2T*13*14*35mm (Any segments can be made)
Grit
6#, 16#, 30#, 40#, 60#, 80#, 120#, 150#...
Bond
Extremely hard, Hard, medium, soft, extremely soft
Color/Marking
As customers' requirements
Used
Grinding For concrete, terrazzo.

HTC Grinding pad b

HTC Grinding pad c



Produce Process

微信图片_20200323152549

diamond grinding pad process



Quick Link

Quanzhou Best Diamond Tools Co.,Ltd.

Chenghuabei Road, Fengze, Quanzhou, Fujian, China
Zip code: 362011
E-mail: info@bestdiamondtool.com
Telephone: 0086-59522017576
Mobile:0086-13599721150
Whatsapp/Wechat/Skype: 008613599721150

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